The head office is located in Suzhou Industrial Park, China,committed to providing grinding and sawing one-stop service.
Focus on Asia market, providing cost down activity and improving productivity
Products:
Used equipment: Buy / Lease / Sell
Semiconductor equipment design and sell
Hubless blade and UV tape design and sell
General agent:Equipment, instrument and material
Dicing saw retrofitting, parts selling and parts repair
总公司位于苏州工业园区,在马来西亚吉隆坡和日本东京设有办事处。公司由中国,日本,台湾,马来西亚多名半导体行业资深从业人员组成,致力于提供研磨切割一站式服务。
主要提供:
SEMICON CHINA 2020将会于6月27日至29日在上海举办
MAHR,CHOTEST半导体行业代理,苏州思达优科技
DISCO DGP8761 ,DGP8760,DGP8560
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