The head office is located in Suzhou Industrial Park, China,committed to providing grinding and sawing one-stop service.

Focus on Asia market, providing cost down activity and improving productivity

Products：

• Used equipment: Buy / Lease / Sell

• Semiconductor equipment design and sell

• Hubless blade and UV tape design and sell

• General agent：Equipment, instrument and material

• Dicing saw retrofitting, parts selling and parts repair

总公司位于苏州工业园区，在马来西亚吉隆坡和日本东京设有办事处。公司由中国，日本，台湾，马来西亚多名半导体行业资深从业人员组成，致力于提供研磨切割一站式服务。

主要提供：

• 切割研磨相关的二手设备回收，租赁和销售
• 切割研磨相关的小设备研发，代理和销售
• 切割研磨相关的UV膜，刀片等耗材研发和销售
• 切割研磨相关的级改造，配件销售和维修