Star Union Technology was founded in 2019 with its headquarters located in Changshu, China, a company specialized in Back Grinder, Wafer Dicing, Singulation equipment, material and parts one-stop solution, and its global sales office in Kuala Lumpur, Malaysia.

STAR UNION is driven by the founders and a group of semiconductor senior experts from China, Japan, and Malaysia which came from various multinational semiconductor company, well known universities and overseas returnees. The R&D core team member is team up by the local and oversea personnel with more than 20 years of experience.


DISCO Used Equipment, STAR UNION brand accessory equipment, new equipment agent, Modification, Overhaul Maintenance, Parts and Repair.

Supplied Market:

Bumping/IC/MEMS/Memory/IR Glass/WLCSP/COB/LED etc.

Company Profile

  • Company Address
    Block 18, No.1378, XingRun Industrial Park, XinZhuang Avenue, XinZhuang Town, Changsu, Jiangsu Province, P.R.
  • Employee
    Total:92 Employee
  • Products
    R&D, assembly and sales of equipment and materials related to semiconductor cutting process
  • CHINA Office
    Sales Office:Suzhou, Xiamen
    Production Base:Suzhou(15640 ft2),Xiamen(16146 ft)
  • Oversea Office
    Kuala Lumpur,Tokyo



Refurbishment Area

R&D, Test Cut Center

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