Agent products

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Grinding Wheel

减薄砂轮

Roug

粗磨
Fine

细磨
Polish

抛光
Compound

环氧树脂

Tapes

胶带

Taping

减薄
Detaping

撕膜
Mounter

晶圆切割
Tape Saw

基板切割

Cutting Liquid

切割液/镭射保护液

Wafer Sawing

切割保护液
Laser Coating Film

镭射保护液

全新切割分选机

DISCO DFD6750

Jig Saw Singulation

全自动减薄机

8/12寸三轴
全自动减薄撕膜贴膜一体机

8/12寸三轴
全自动切割机

8寸双轴
全自动切割机

12寸双轴
半自动切割机

8寸单轴
半自动切割机

12寸单轴

白光干涉显微镜

White Light Interference
Microscope

激光扫描共聚焦显微镜

Laser Scanning Confocal
Microscope

Bumping Process
Wafer Roughness
Laser Groving
Die Brack
DA Epoxy Height
WB Wire Loop
TSV Micro Vias

contact us

If you have any questions or inquiries, please feel free to contact us

WeChat:
Tel: +86-189-6219-8497

Products
- Equipment OEM
  
  Full-auto Wafer Saw (12inch) Full-auto BG Taping Auto Wafer Mounter (DAF&Non-precut) Auto Spinner Coater Auto Wafer Mount Auto Wafer Mount (DAF) Auto Wafer Mount (PKG) Auto UV Cure (LED) Full-auto UV Cure (LED) Spinner Cleaner Jig Saw Vacuum Pump Manul Wafer Mounter Manul Package Mounter Manul Detaping Daimmaflow Tank CO2 Ejector
- Equipment Agent
  
  DISCO Jig Saw Microscope
  
  Our-source Service
  
  Grinding Laser Dicing
- Material
  
  Hubless Blade Grinder Wheel UV Tape Dicing Fluid Dressing Board Dummy Wafer Wafer Frame Cassette
- Used Equipment
  
  DISCO TSK NITTO LINTEC TAKATORI HANMI KNS SHINKAWA ASM ESEC DATACON CAMTEK
  
  Invertory
- Service
  
  Centrolize Control System Modification Refurbishment Inspection Training Installation
- Parts
  
  Flange Chuck Table (Saw） Chuck Table (BG) Bellows Oilstone Robot Hand Height Gauge Carbon Brush Cutting Blade UV Lamp
- Repair
  
  Laser Head Dicer Spindle Grinder Spindle Chuck Table Height Gauge Touch Panel Driver Control Board Hub Blade Repair

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